👋 Hi, I’m Tianyu Bai

⚙️ Research Vision

_{Photo credit: Mark Washburn}

Engineering the future of high-bandwidth neural interfaces. I bridge the gap between Microelectronics and Neuroscience.

Design ➔ Fabricate ➔ Validate

🛠️ Engineering Core & Projects

🚀 E-Link(256) Click to know more ↗
Leading the development of a 256-ch high-density connector.

⚡ Advanced PCB Design: Rigid-Flex and HDI technology expert.

🔬 Microsystems: Miniaturized hardware implementations.

🧰 Technical Skills & Tech Stack

⚡ Hardware & PCB Design

High-Density Integration: Specialized in Multilayer, Rigid-Flex, and HDI PCB design.
Advanced Routing: Expert in Blind/Buried Vias and high-speed SPI/Digital Interfaces.
Manufacturing: Proficient in SMT & THT Assembly, focusing on reliability in space-constrained systems.

🔬 Fabrication & Prototyping

Cleanroom Microfabrication: Expert in Photolithography, Magnetron Sputtering, and Thermal Evaporation.
Micro-Assembly: Skilled in Transfer Printing for flexible electronics.
Rapid Prototyping: CNC Machining, Laser Cutting, and 3D Printing (FDM).

🧪 Characterization & Testing

Imaging: 3D Microscopy, SEM (Scanning Electron Microscopy).
Metrology: Profilometer and Surface Analysis.
Electrochemistry: Electrochemical Impedance Spectroscopy (EIS) for neural interface validation.
Reliability: Mechanical stress testing and Accelerated Aging Tests.

💻 Software & Simulation

👋 你好，我是白天宇

⚙️ 研究愿景

_{摄影：Mark Washburn}

专注于构建未来的高带宽神经接口。在微电子学与神经科学之间搭建桥梁。

设计 ➔ 制造 ➔ 验证

🛠️ 核心工程项目

🚀 E-Link易链(256) 点击了解更多 ↗
主导设计研发 256 通道高密度神经接口连接器。

⚡ 高级 PCB 设计: 软硬结合电路板与高密度多层互连 (HDI) 技术专家。

🔬 微系统: 硬件微型化与系统集成。

🧰 专业技能与技术栈

⚡ 硬件与电路板设计

高密度集成: 专注于 多层板、软硬结合板 (Rigid-Flex) 以及 高密度互连电路板 设计。
高级布线: 精通 盲/埋孔 技术及高速 SPI/数字接口 布线。
制造与组装: 熟练掌握 SMT 与 THT 贴片组装，专注于空间受限系统的高可靠性实现。

🔬 微纳制造与原型开发

超净间微加工: 精通光刻、磁控溅射 以及 热蒸镀 等微纳加工工艺。
微组装: 熟练掌握用于柔性电子的 转印技术。
快速原型制作: 数控加工、激光切割以及 3D 打印。

🧪 表征与测试

成像分析: 3D 显微成像，SEM (扫描电子显微镜)。
形貌测量: 台阶仪 (Profilometer) 与表面形貌分析。
电化学: 用于神经接口验证的电化学阻抗谱测试。
可靠性测试: 机械应力测试与加速老化实验。

💻 软件与仿真

📫 Let’s Connect

🌐 Personal Website: tianyu-bai.github.io
💼 LinkedIn: linkedin.com/in/tianyubai
📧 Email: tianyu.bai.th@dartmouth.edu

📫 与我联系

🌐 个人网站: tianyu-bai.github.io
💼 领英: linkedin.com/in/tianyubai
📧 邮箱: tianyu.bai.th@dartmouth.edu

🔥 News

2026.01: 🎉 Abstract accepted for an Oral Presentation at the 2026 MRS Spring Meeting! I will present our work in Session SB01.05 (Neurointerfacing) this April in Hawaii.
2026.01: 🚀 Released the E-Link(256) open-source project, an ultra-compact, solderless 256-channel neural interface connector.

Miniaturized 256-Channel Neural Connector

Intan-based Customized Low-Noise Headstage
2025.10: 💡 Participated in the Startup Weekend at the Magnuson Center for Entrepreneurship.

Startup Weekend Pitch Session
2024.11: 🥈 Awarded 2nd place in the VIT research image contest.
2023.10: 🛠️ Developed a customized 16-channel miniaturized connector for Intan RHD16.

16-Channel Interface

Full Assembly
2023.06: 🔬 Micro-fabricated a batch of Multi-Modal Neural Probes.

Photo 1: Patterning

Photo 2: Fabricated

Photo 3: Gold Patterning

Photo 4: Distal Tip
2022.12: 📐 Designed and developed a Compact 6-layer PCB Connector for 64/128-channel neural probes.

6-Layer Compact Connectors for 64/128Ch Probes

🔥 最新动态

2026.01: 🎉 摘要被 2026 MRS 春季会议 接收为 口头报告 (Oral Presentation)！我将于今年 4 月前往夏威夷，在 SB01.05 分会场 (神经接口) 展示我们的研究成果。
2026.01: 🚀 发布 E-Link(256) 开源项目：一款 256 通道高密度神经接口小型连接器。

微型化 256 通道神经接口连接器

基于 Intan 定制的低噪声放大器
2025.10: 💡 参加达特茅斯 Magnuson 创业中心的 创业周 (Startup Weekend) 活动。

创业周末路演环节
2024.11: 🥈 在 科技远见者 (VIT) 科研图像大赛中荣获 二等奖。
2023.10: 🛠️ 为 Intan RHD16 设计开发了定制的 16 通道微型化连接器。

16 通道接口

完整组装图
2023.06: 🔬 成功微纳加工了一批 可同时检测电信号与神经递质信号的多模态神经探针。

图 1：光刻图案化

图 2：探针成品

图 3：金电极显微图

图 4：探针尖端
2022.12: 📐 为 64/128 通道神经探针设计开发了 紧凑型 6 层 PCB 连接器。

用于 64/128 通道探针的 6 层紧凑型连接器

📚 Publications

2025 ACS Chemical Neuroscience Thin-Film Reference Electrodes for Fast-Scan Cyclic Voltammetry
- Y. Qi, J. Ryu, D. Jang, B. Schaub, Y. Shin, T. Bai, G. Li, J. P. Aronson, J. C. Leiter, et al.
- Summary: Evaluates Pt-Ir thin-film electrodes as stable, miniaturized alternatives to Ag/AgCl for reliable neurotransmitter detection in preclinical applications.

2025 Nature Communications Stabilized carbon coating on microelectrodes for scalable and interoperable neurotransmitter sensing

Y. Qi, D. Jang, J. Ryu, T. Bai, Y. Shin, W. Gu, A. Iyer, G. Li, H. Ma, J. Liou, et al.
Summary: Features a unique carbon-coating approach for high-performance voltammetry, enabling sub-second dopamine detection in vivo with extraordinary scalability.

2025 Nature Electronics Monolithic three-dimensional neural probes from deterministic rolling of soft electronics
- Y. Qiang, W. Gu, D. Jang, Y. Shin, D. Shi, K. J. Seo, G. Li, S. Vinnikova, S. Wu, T. Bai, et al.
- Summary: Introduces a “rolling-of-soft-electronics” method to transform planar devices into 3D probes, enabling high-density 3D spatiotemporal mapping of spike activities.

2025 Annual Review of Biomedical Engineering Lessons Learned and Challenges Ahead in the Translation of Implantable Microscale Sensors and Actuators

J. Y. Park, N. Barrera, T. Bai, E. Meng, H. Fang, H. Lee.
Summary: A comprehensive review analyzing the regulatory prerequisites and design disparities between academic research prototypes and market-ready clinical products.

2024 npj Flexible Electronics Flexible electronic-photonic 3D integration from ultrathin polymer chiplets
- Y. Huang, G. Li, T. Bai, Y. Shin, X. Wang, A. More, P. Boucher, et al.
- Summary: Details the CHIP process for robust 3D integration of polymer-based circuits, combining high-density microelectrodes with micro-LEDs for optogenetic stimulation.
2024 Advanced Materials Multifunctional Nanomesh Enables Cellular-Resolution, Elastic Neuroelectronics
- J. Ryu, Y. Qiang, L. Chen, G. Li, X. Han, E. Woon, T. Bai, Y. Qi, S. Zhang, J. Liou, et al.
- Summary: Presents a novel nanomesh approach to achieve reliable elastic microelectrodes on PDMS silicone with unprecedented cellular resolution for single-unit recording.
2024 Biosensors and Bioelectronics Array-wide uniform PEDOT:PSS electroplating from potentiostatic deposition
- Y. Shin, J. Ryu, T. Bai, Y. Qiang, Y. Qi, G. Li, Y. Huang, K. J. Seo, H. Fang.
- Summary: Establishes a potentiostatic method to achieve a highly uniform coating of PEDOT:PSS on large-scale microelectrode arrays with high yield and stability.

2017 The 29th Chinese Control And Decision Conference (CCDC) A control method to prevent falling from a treadmill based on STM32 microcontroller and ultrasonic transducer

T. Bai.
Summary: Implemented an intelligent electronic control method using an STM32 microcontroller and ultrasonic sensors to real-time adjust motor speed based on gait detection.

📜 Patents

2017 A Device of Preventing Falling from Treadmill
- Tianyu Bai. Patent ID: CN106334286A
2016 Detection-identification and falling-prevention electronic control device for running apparatus and method
- Tianyu Bai. Patent ID: CN206152181U
- Summary: An intelligent control system featuring a multi-sensor array (ultrasonic and vibration probes) to accurately judge user motion and adjust treadmill motor speed in real-time.
2014 A kind of super-low resistance joint for connecting wire
- Tianyu Bai. Patent ID: CN204348933U
- Summary: Developed a superconducting conductor groove design to achieve ultra-low joint resistance at the micro-ohm (μΩ) or even nano-ohm (nΩ) level through optimized overlapping area.

📢 Upcoming Talks

MRS Spring 2026

📊 Research Analytics Dashboard (Source: Google Scholar)

📚 学术发表

2025 ACS化学神经科学 用于快速扫描循环伏安法的薄膜参比电极
- Y. Qi, J. Ryu, D. Jang, B. Schaub, Y. Shin, T. Bai, G. Li, J. P. Aronson, J. C. Leiter, et al.
- 摘要: 评估了铂铱薄膜电极作为传统银/氯化银的稳定微型化替代方案，用于临床前应用中可靠的神经递质检测。
2025 自然-通讯 用于可扩展和可互操作神经递质传感的微电极稳定碳涂层
- Y. Qi, D. Jang, J. Ryu, T. Bai, Y. Shin, W. Gu, A. Iyer, G. Li, H. Ma, J. Liou, et al.
- 摘要: 采用独特的碳涂层方法实现高性能伏安法，能够在体内实现亚秒级多巴胺检测，并具有极佳的可扩展性。
2025 自然-电子 基于柔性电子确定性卷曲的单片三维神经探针
- Y. Qiang, W. Gu, D. Jang, Y. Shin, D. Shi, K. J. Seo, G. Li, S. Vinnikova, S. Wu, T. Bai, et al.
- 摘要: 提出了“柔性电子卷曲”法，将平面器件转化为 3D 探针，实现了动作电位活动的高密度三维时空标测。

2025 生物医学工程年度评论 植入式微型传感器与致动器转化过程中的经验教训与未来挑战

J. Y. Park, N. Barrera, T. Bai, E. Meng, H. Fang, H. Lee.
摘要: 深入分析了学术研究原型与面向市场的临床产品之间的监管先决条件与设计差异的综述。

2024 npj柔性电子 基于超薄聚合物小芯片的柔性电子-光子 3D 集成
- Y. Huang, G. Li, T. Bai, Y. Shin, X. Wang, A. More, P. Boucher, et al.
- 摘要: 详细介绍了用于聚合物基电路稳健 3D 集成的 CHIP 工艺，将高密度微电极与光遗传学刺激用的微型 LED 完美结合。
2024 先进材料 多功能纳米网格实现细胞级分辨率的弹性神经电子器件
- J. Ryu, Y. Qiang, L. Chen, G. Li, X. Han, E. Woon, T. Bai, Y. Qi, S. Zhang, J. Liou, et al.
- 摘要: 提出了一种新型纳米网格方法，在 PDMS 硅胶上实现了可靠的弹性微电极，为单细胞记录提供了前所未有的超高分辨率。
2024 生物传感器与生物电子学 基于恒电位沉积的阵列级均匀 PEDOT:PSS 电镀
- Y. Shin, J. Ryu, T. Bai, Y. Qiang, Y. Qi, G. Li, Y. Huang, K. J. Seo, H. Fang.
- 摘要: 建立了一种恒电位沉积方法，在大型微电极阵列上实现了 PEDOT:PSS 的高度均匀涂层，具备极高的良率和稳定性。

2017 第29届中国控制与决策会议 (CCDC) 基于 STM32 微控制器和超声波传感器的跑步机防跌落控制方法

T. Bai.
摘要: 实现了一种基于 STM32 微控制器和超声波传感器的智能电子控制方法，通过步态检测实时调整电机速度以防止人员跌落。

📜 专利

2017 一种跑步器械的探测识别与防摔电子控制装置及方法
- Tianyu Bai. 专利号: CN106334286A
2016 检测跑步设备防跌落的电子控制装置
- Tianyu Bai. 专利号: CN206152181U
- 摘要: 一种智能控制系统，采用多传感器阵列（超声波和振动探头），准确判断用户运动状态并实时调整跑步机电机速度。
2014 一种用于连接导线的超低电阻接头
- Tianyu Bai. 专利号: CN204348933U
- 摘要: 开发了一种超导线槽设计，通过优化重叠面积，实现微欧姆 (μΩ) 甚至纳欧姆 (nΩ) 级别的超低接头电阻。

📢 近期报告

2026材料研究学会

📊 科研数据可视化面板 (数据来源: 谷歌学术)

CITATIONS文章引用量

Mar 20262026年2月

H-INDEXH 指数

Since 20212021年至今

PATENTS专利成果

Granted已授权

🎖 Honors and Awards

2024.11 2nd Place, Visionaries in Technology (VIT) Research Image Contest, Dartmouth Engineering (Featured Work: “Optogenetic Neuroprobe” — highlighting precision engineering in neural interface)
2024.07 I-Trep Travel Scholarship, Biomedical Entrepreneurship Summer Course, University of Vermont
2022.04 PhD Innovation Fellowship, Thayer School of Engineering, Dartmouth College
2020.07 Dean’s Fellowship Award, Northeastern University
2019.12 Pursuit of Excellence in Engineering Diversity and Inclusion Honor, University of Missouri
2019.12 Bronze Medallion Cast Recipient, Undergraduate Honors Ceremony, University of Missouri
2019.10 Big Ten+ Graduate Expo Travel Scholarship, Purdue University
2019.08 Cum Laude Honor, University of Missouri
2018 - 2019 Dean’s High List (Consecutive Enrolled Semesters), College of Engineering, University of Missouri
2019 Curator’s Grant-in-Aid Scholarship, University of Missouri
2019.07 Donald B. Atkinson Scholarship, University of Missouri

🎖 荣誉与奖项

2024.11 二等奖, 科技远见主题 (VIT) 科研图片比赛, 美国达特茅斯学院 (获奖作品：”光遗传神经探针” — 突出神经接口中的精密工程)
2024.07 I-Trep 项目奖学金, 生物医学创新创业暑期课程, 美国佛蒙特大学
2022.04 博士创新创业奖学金 (PhD Innovation Fellowship), 塞耶工程学院, 美国达特茅斯学院
2020.07 院长奖学金 (Dean’s Fellowship Award), 美国东北大学
2019.12 工程领域多元与包容卓越荣誉称号,美国密苏里大学
2019.12 优秀毕业生奖章获得者 (Bronze Medallion Cast), 本科荣誉典礼, 美国密苏里大学
2019.10 Big Ten+ 毕业生博览会奖学金, 美国普渡大学
2019.08 优等生荣誉 (Cum Laude), 美国密苏里大学
2018 - 2019 院长优秀学生名单 (Dean’s High List) (连续在读学期), 工程学院, 美国密苏里大学
2019 策展人奖助学金 (Curator’s Grant-in-Aid Scholarship), 美国密苏里大学
2019.07 Donald B. Atkinson 奖学金, 美国密苏里大学

📖 Education

2021.07 - 2026.11 (Expected), Dartmouth College, Hanover, NH
- Doctor of Philosophy - PhD, Engineering Science
- Activities: Research Assistant at MINE Lab
- Advisor: Prof. Hui Fang
- Honors: PhD Innovation Fellowship Recipient
2020.08 - 2021.06, Northeastern University, Boston, MA
- PhD Student in Microsystems, Materials and Devices
- Honors: Dean’s Fellowship Recipient
2017.08 - 2019.12, University of Missouri-Columbia, Columbia, MO
- Bachelor of Science in Electrical and Electronics Engineering
- Honors: Cum Laude, Dean’s list Recipient

    Visitors since Mar 30th 2026:
  

"Translating technical innovation into human impact."

📖 教育背景

2021.07 - 2026.11 (预计), 美国达特茅斯学院 (Dartmouth College), 汉诺威, 新罕布什尔州
- 博士 (PhD) - 工程科学
- 科研经历: 多功能集成神经电子 (MINE) 实验室 研究助理
- 导师: 方辉教授
- 荣誉: 博士创新奖学金 (PhD Innovation Fellowship) 获得者
2020.08 - 2021.06, 美国东北大学 (Northeastern University), 波士顿, 马萨诸塞州
- 博士生 - 微系统、材料与器件方向
- 荣誉: 工程学院院长奖学金 (Dean’s Fellowship) 获得者
2017.08 - 2019.12, 美国密苏里大学 (University of Missouri-Columbia), 哥伦比亚, 密苏里州
- 理学学士 - 电气与电子工程
- 荣誉: 优等生荣誉 (Cum Laude), 连续入选院长优秀学生名单 (Dean’s list)

    自 2026年3月30日 访问人数:
  

"致力于将技术创新转化为造福人类。"

Tianyu Bai