👋 Hi, I’m Tianyu Bai

⚙️ Research Vision

Engineering the future of high-bandwidth neural interfaces. I bridge the gap between Microelectronics and Neuroscience through end-to-end hardware development.

**Design** (Schematic & Layout) ➔ **Fabricate** (Cleanroom & Microfab) ➔ **Validate** (Bench & In-Vivo)

🛠️ Engineering Core & Projects

🚀 E-Link(256) (Click to know more): Leading the development of a 256-ch high-density connector.

⚡ Advanced PCB Design: Rigid-Flex and HDI technology expert.

🔬 Microsystems: Miniaturized hardware implementations.

🧰 Technical Skills & Tech Stack

⚡ Hardware & PCB Design

• High-Density Integration: Specialized in Multilayer, Rigid-Flex, and HDI PCB design.
• Advanced Routing: Expert in Blind/Buried Vias and high-speed SPI/Digital Interfaces.
• Manufacturing: Proficient in SMT & THT Assembly, focusing on reliability in space-constrained systems.

🔬 Fabrication & Prototyping

• Cleanroom Microfabrication: Expert in Photolithography, Magnetron Sputtering, and Thermal Evaporation.
• Micro-Assembly: Skilled in Transfer Printing for flexible electronics.
• Rapid Prototyping: CNC Machining, Laser Cutting, and 3D Printing (FDM).

🧪 Characterization & Testing

• Imaging: 3D Microscopy, SEM (Scanning Electron Microscopy).
• Metrology: Profilometer and Surface Analysis.
• Electrochemistry: Electrochemical Impedance Spectroscopy (EIS) for neural interface validation.
• Reliability: Mechanical stress testing and Accelerated Aging Tests.

💻 Software & Simulation

📫 Let’s Connect

• 🌐 Personal Website: tianyu-bai.github.io
• 💼 LinkedIn: linkedin.com/in/tianyubai
• 📧 Email: tianyu.bai.th@dartmouth.edu

🔥 News

• 2026.01: 🎉 Abstract accepted for an Oral Presentation at the 2026 MRS Spring Meeting! I will present our work in Session SB01.05 (Neurointerfacing) this April in Hawaii.

• 2026.01: 🚀 Released the PEDAL-256 open-source project, an ultra-compact, solderless 256-channel neural interface connector.

• 2025.10: 💡 Participated in the Startup Weekend at the Magnuson Center for Entrepreneurship.
  • Received mentorship on IP protection and customer discovery, pitching a neurotech-focused venture idea.

  

• 2024.11: 🥈 Awarded 2nd place in the Visionaries in Technology (VIT) research image contest hosted by Thayer School of Engineering.
  • Featured Work: “Optogenetic Neuroprobe”— A state-of-the-art device showcasing high-density integration. The probe features a sophisticated 4-layer stack integrating six InGaN-based micro-LEDs to enable simultaneous multi-site stimulation and high-precision neural recording.

📚 Publications

• 2025 ACS Chemical Neuroscience

  Thin-Film Reference Electrodes for Fast-Scan Cyclic Voltammetry

  • Y. Qi, J. Ryu, D. Jang, B. Schaub, Y. Shin, T. Bai, G. Li, J. P. Aronson, J. C. Leiter, et al.
  • Summary: Evaluates Pt-Ir thin-film electrodes as stable, miniaturized alternatives to Ag/AgCl for reliable neurotransmitter detection in preclinical applications.

• 2025 Nature Communications

  Stabilized carbon coating on microelectrodes for scalable and interoperable neurotransmitter sensing

  • Y. Qi, D. Jang, J. Ryu, T. Bai, Y. Shin, W. Gu, A. Iyer, G. Li, H. Ma, J. Liou, et al.
  • Summary: Features a unique carbon-coating approach for high-performance voltammetry, enabling sub-second dopamine detection in vivo with extraordinary scalability.

• 2025 Nature Electronics

  Monolithic three-dimensional neural probes from deterministic rolling of soft electronics

  • Y. Qiang, W. Gu, D. Jang, Y. Shin, D. Shi, K. J. Seo, G. Li, S. Vinnikova, S. Wu, T. Bai, et al.
  • Summary: Introduces a “rolling-of-soft-electronics” method to transform planar devices into 3D probes, enabling high-density 3D spatiotemporal mapping of spike activities.

• 2025 Annual Review of Biomedical Engineering

  Lessons Learned and Challenges Ahead in the Translation of Implantable Microscale Sensors and Actuators

  • J. Y. Park, N. Barrera, T. Bai, E. Meng, H. Fang, H. Lee.
  • Summary: A comprehensive review analyzing the regulatory prerequisites and design disparities between academic research prototypes and market-ready clinical products.

• 2024 npj Flexible Electronics

  Flexible electronic-photonic 3D integration from ultrathin polymer chiplets

  • Y. Huang, G. Li, T. Bai, Y. Shin, X. Wang, A. More, P. Boucher, et al.
  • Summary: Details the CHIP process for robust 3D integration of polymer-based circuits, combining high-density microelectrodes with micro-LEDs for optogenetic stimulation.

• 2024 Advanced Materials

  Multifunctional Nanomesh Enables Cellular-Resolution, Elastic Neuroelectronics

  • J. Ryu, Y. Qiang, L. Chen, G. Li, X. Han, E. Woon, T. Bai, Y. Qi, S. Zhang, J. Liou, et al.
  • Summary: Presents a novel nanomesh approach to achieve reliable elastic microelectrodes on PDMS silicone with unprecedented cellular resolution for single-unit recording.

• 2024 Biosensors and Bioelectronics

  Array-wide uniform PEDOT:PSS electroplating from potentiostatic deposition

  • Y. Shin, J. Ryu, T. Bai, Y. Qiang, Y. Qi, G. Li, Y. Huang, K. J. Seo, H. Fang.
  • Summary: Establishes a potentiostatic method to achieve a highly uniform coating of PEDOT:PSS on large-scale microelectrode arrays with high yield and stability.

• 2017 The 29th Chinese Control And Decision Conference (CCDC)

  A control method to prevent falling from a treadmill based on STM32 microcontroller and ultrasonic transducer

  • T. Bai.
  • Summary: Implemented an intelligent electronic control method using an STM32 microcontroller and ultrasonic sensors to real-time adjust motor speed based on gait detection.

📜 Patents

• 2017 A Device of Preventing Falling from Treadmill

  • Tianyu Bai.

    Patent ID: 106334286A

• 2016 Detection of anti-fall electronic control device for running equipment

  • Tianyu Bai.

    Patent ID: 201621157629.8

  • Summary: An intelligent control system featuring a multi-sensor array (ultrasonic and vibration probes) to accurately judge user motion and adjust treadmill motor speed in real-time.
• 2014 Ultra low resistance joint for connecting wires

  • Tianyu Bai.

    Patent ID: 201420557893.5

  • Summary: Developed a superconducting conductor groove design to achieve ultra-low joint resistance at the micro-ohm ($\mu\Omega$) or even nano-ohm ($n\Omega$) level through optimized overlapping area.

📢 Upcoming Talks

• MRS Spring 2026

📊 GitHub & Research Stats

➜ system_monitor --user=tianyu-bai

CORE_STATUS: ACTIVE

🎖 Honors and Awards

• 2024.11 2nd Place, Visionaries in Technology (VIT) Research Image Contest, Dartmouth Engineering (Featured Work: “Optogenetic Neuroprobe” — highlighting precision engineering in neural interface)
• 2024.07 I-Trep Travel Scholarship, Biomedical Entrepreneurship Summer Course, University of Vermont
• 2022.04 PhD Innovation Fellowship, Thayer School of Engineering, Dartmouth College
• 2020.07 Dean’s Fellowship Award, Northeastern University
• 2019.12 Pursuit of Excellence in Engineering Diversity and Inclusion Honor, University of Missouri
• 2019.12 Bronze Medallion Cast Recipient, Undergraduate Honors Ceremony, University of Missouri
• 2019.10 Big Ten+ Graduate Expo Travel Scholarship, Purdue University
• 2019.08 Cum Laude Honor, University of Missouri
• 2018 - 2019 Dean’s High List (5 Consecutive Semesters), College of Engineering, University of Missouri
• 2019 Curator’s Grant-in-Aid Scholarship, University of Missouri
• 2019.07 Donald B. Atkinson Scholarship, University of Missouri

📖 Education

• 2021.07 - 2026.10 (Expected), Dartmouth College, Hanover, NH
  • Doctor of Philosophy - PhD, Engineering Science
  • Activities: Research Assistant at MINE Lab
  • Advisor: Prof. Hui Fang
  • Honors: PhD Innovation Fellowship Recipient
• 2020.08 - 2021.06, Northeastern University, Boston, MA
  • PhD Student in Microsystems, Materials and Devices
  • Honors: Dean’s Fellowship Recipient
• 2017.08 - 2019.12, University of Missouri-Columbia, Columbia, MO
  • Bachelor of Science in Electrical and Electronics Engineering
  • Honors: Cum Laude, Dean’s list Recipient

"Translating technical innovation into human impact."